Mass-producing lead frames compliant with high-pin count and narrow pitch semiconductors
Producing all types of lead frames
Semiconductors require an ever-expanding variety of lead frames to operate. ROHM MECHATECH supplies high-precision, top quality, mass-produced lead frames, with services ranging from die design and production to stamping die assembly.
Punching width in minimum 80µm
Stamping Die is skillfully assembled using high-precision components developed in-house. ROHM MECHATECH can meet our customer’s various requirements with advanced Die development and production capabilities and mass-production stamping technology.
Meeting all Leadframes needsThe Leadframes of semiconductor devices, such as ICs, transistors and diodes, are becoming increasingly diversified and are required to be higher in precision. ROHM MECHATECH has a cohesive mass production bases from design, fabrication, assembly, up to Leadframes production all in house.
Technologies for mass production using forging and drawing